Journal Articles Book Chapters US Patents Media Coverage

Journal Articles

  1. C. R. Isenhart, A. C. Hayes, G. L. Whiting. Additive Manufacutring of Scaleable Jet Impingement and Radial Taper Enhancements for Improved Flow Boiling Performance,听Applied Thermal Engineering,听2024, DOI: 10.1016/j.applthermaleng.2024.123355. ()
  2. E. Strand, E. Bihar, G. L. Whiting, et al. Roadmap on听Printable Electronic Materials for Next-Generation Sensors.听Nano Futures,听2024, DOI: 10.1088/2399-1984/ad36ff. ()
  3. J-B. Kauzya, B. Hayes, A. C. Hayes, J. F. Thompson, C. Bellerjeau, K. Evans, J. Osio-Norgaard, G. Gavai, K. Dikshit, C. Bruns, R. MacCurdy, R. A. Street, G. L. Whiting. Direct Ink Writing of Viscous Inks in Variable Gravity Regimes using Parabolic Flights.听Acta Astronautica,听2024, 219, 569. ()
  4. C. L. Baumbauer, A. Gopalakrishnan, M. Atreya, G. L. Whiting, A. C. Arias. Polycaprolactone-based Zinc Ink for High Conductivity Transient Printed Electronics and Antennas.听Advanced Electronic Materials,听2024, 2300658. ()
  5. A. Hayes, V. Sundaram, G. Williams, S. Venkatesh, C. Isenhart, A. Yervez, C. Myles, V. Sebulsky, K. Jayaram, M. Vance, G. L. Whiting. Meeting Schools where they are: Integrating Engineering Outreach Curriculum in the Classroom without Forcing an Agenda. 2023听American Society for Engineering Education听Rocky Mountain Section Conference.听2023. ()
  6. E. Bihar, E. J. Strand, C. A. Crichton, M. N. Renny, I. Bonter, T. Tran, M. Atreya, A. Gestos, J. Haseloff, R. R. McLeod, G. L. Whiting. Self-healable Stretchable Printed Electronic Cryogels for in-vivo Plant Monitoring.听NPJ Flexible Electronics,听2023,听7, 48. ()
  7. Y. Qiu, Z. Zou, Z. Zou, N. K. Setiawan, K. V. Dikshit, G. L. Whiting, F. Yang, W. Zhang, J. Lu, B. Zhong, H. Wu, J. Xiao. Deep-learning-assisted Printed Liquid Metal Sensory System for Wearable Applications and Boxing Training.听NPJ Flexible Electronics,听2023,听7, 37. ()
  8. B. Hayes, G. L. Whiting, R. MacCurdy. An OpenFOAM Framework to Model Thermal Bubble-driven Micro-pumps.听Physics of Fluids,听2023,听35, 062013. ()
  9. A. C. Hayes, E. A. Tr盲ff, C. V. S酶rensen, S. V. Willems, N. Aage, O. Sigmund, G. L. Whiting. Topology Optimization for Structural Mass Reduction of Direct Drive Electric Machines.听Sustainable Energy Technologies and Assessments,听2023,听57,听103254. ()
  10. E. J. Strand, M. J. Palizzi, C. A. Crichton, M. N. Renny, E. Bihar, R. R. McLeod, G. L. Whiting. Multimodal Operation of Printed Electrochemical Transistors for Sensing in Controlled Environment Agriculture.听Sensors and Actuators B: Chemical,听2023, 387, 133763. ()
  11. M.听Atreya, S. DeSousa, J-B. Kauzya, E. G. Williams, A. C. Hayes, K. Dikshit, J. Nielsen, A. Palmgren, S. Khorchidian, S. Liu, A. Gopalakrishnan, E. Bihar, C. J. Bruns, R. Bardgett, J. N. Quinton, J. Davies, J. C. Neff, G. L. Whiting. A Transient Printed Soil Decomposition Sensor based on a Biopolymer Composite Conductor. Advanced Science,听2023,听10, 2205785. ()
  12. M. Atreya, G. Marinick, C. Baumbauer, K. V. Dikshit, S. Liu, C. Bellerjeau, J. Nielsen, S. Khorchidian, A. Palmgren, Y. Sui, R. Bardgett, D. Baumbauer, C. J. Bruns, J. C. Neff, A. C. Arias, G. L. Whiting. Wax Blends as Tunable Encapsulants for Soil-Degradable Electroincs.听ACS Applied Electronic Materials, 2022, 4, 4912 . ()
  13. B. Hayes, L. Smith, H. Kibbutz, A. C. Hayes, G. L. Whiting, K. Jayaram, R. MacCurdy. Rapid Fabrication of Low-Cost Thermal Bubble-Driven Micro-Pumps.听Micromachines, 2022,听13, 1634. ()
  14. A. Muehlbradt, G. L. Whiting, S. Kane, L. Devendorf. Knitting Access: Exploring Stateful Textiles with People with Disabilities.听Dis '22: Designing Interactive Systems Conference,听2022, 1058. ()
  15. H. Vennard, A. C. Hayes, G. L. Whiting. CFD Analysis of Additively Manufactured Conformal Cooling Channels for the Stator of a Direct Drive Generator.听Proceedings of the 2022 ASME Power Conference, VT001T15A003,听2022, V001T15A003. ()
  16. A. C. Hayes, G. L. Whiting. An Analysis of Different Techniques for Cooling Direct Drive Generators.听Proceedings of the 2022 ASME Power Conference,听2022, VT001T15A002. ()
  17. Y. Sui, A. N. Radwan, A. Gopalakrishnan, K. Dikshit, C. J. Bruns, C. A. Zorman, G. L. Whiting. A Reactive Inkjet Printing Process for Fabricating Biodegradable Conductive Zinc Structures.听Advanced Engineering Materials,听2022, 25, 2200529. ()
  18. T. Hainsworth, I. Schmidt, V. Sundaram, G. L. Whiting, C. Keplinger, R. MacCurdy.听Simulating Electrohydraulic Soft Actuator Assemblies Via Reduced Order Modeling.听2002 IEEE 5th International Conference on Soft Robotics (RoboSoft),听2022, 21-28. ()
  19. J. E. Barthold, K. McCreery, J. Martinez, C. Bellerjeau, Y. Ding, S. J. Bryant, G. L. Whiting, C. P. Neu. Particulate ECM Biomaterial Ink is 3D Printed and Naturally Crosslinked to form Structurally-Layered and Lubricated Cartilage Tissue Mimics.听Biofabrication,听2022, 14, 025021. ()
  20. E. J. Strand, E. Bihar, S. M. Gleason, S. Han, S. W. Schreiber, M. N. Renny, G. G. Malliaras, R. R. McLeod, G. L. Whiting. Printed Organic Electrochemical Transistors for Detecting Nutrients in Whole Plant Sap.听Advanced Electronic Materials,听2022, 8, 2100853. ()
  21. A.C. Hayes, G. L. Whiting. Coupled Electromagnetic and Lattice Structure Optimization for the Rotor and Stator of Large Electric Machines.听Proceedings of the听2021 ASME Power Conference,听2021,听V001T12A003. ()
  22. A. C. Hayes, J. Osio-Norgaard, S. Miller, G. L. Whiting, M. E. Vance. Air Pollutant Emissions for Multi-Jet Fusion, Material-Jetting, and Digital Light Synthesis Commercial 3D Printers in a Service Bureau.听Building and Environment,听2021,听202, 108008. ()
  23. B. Hayes, G. L. Whiting, R. MacCurdy. Modeling of Contactless Bubble-bubble Interactions in Microchannels with Integrated Inertial Pumps.听Physics of Fluids,听2021,听33, 042002. ()
  24. J. Osio-Norgaard, A. C. Hayes, G. L. Whiting. Sintering of 3D Printable Simulated Lunar Regolith Magnesium Oxychloride Cements.听Acta Astronautica,听2021, 183,听227. ()
  25. A. C. Hayes, G. L. Whiting. Reducing the Structural Mass of Large Direct Drive Wind Turbine Generators through Triply Periodic Minimal Surfaces Enabled by Hybrid Additive Manufacturing.听Clean Technologies,听2021,听3, 227. ()
  26. Y. Sui, M. Atreya, S. Dahal, A. Gopalakrishnan, R. Khosla, G. L. Whiting. Biodegradation of an Addivitely Fabricated Capacitive Soil Moisture Sensor.听ACS Sustainable Chemistry and Engineering,听2021,听9, 2486. ()
  27. A. C. Hayes, J. Osio-Norgaard, S. Miller, M. E. Vance, G. L. Whiting. Influence of Powder Type on Aerosol Emissions in Powder-Binder Jetting with Emphasis on Lunar Regolith for In Situ Space Applications.听ACS Environmental Science and Technology Engineering,听2021, 1, 183. ()听
  28. S. Bahal, W. Yilma, Y. Sui, M. Atreya, S. Bryan, V. Davis, G. L. Whiting, R. Khosla. Degradability of Biodegradable Soil Moisture Sensor Components and their Effect on Maize (Zea mays L.) Growth.听Sensors,听2020, 20, 6154. ()
  29. M. Atreya, K. V. Dikshit, G. Marinick, J. Nielson, C. Bruns, G. L. Whiting. A Poly(lactic acid)-based Ink for Biodegradable Printed Electronics with Conductivity Enhanced through Solvent Aging.听ACS Applied Materials and Interfaces,听2020, 12, 23494.听()
  30. A. C. Hayes, G. L. Whiting.听Powder-Binder Jetting Large-Scale, Metal Direct-Drive Generators: Selecting the Powder, Binder, and Process Parameters. Proceedings of the听2019 ASME Power Conference,听2019,听V001T12A004. ()
  31. J. F. Thompson, C. Bellerjeau, G. Marinick, J. Osio-Norgaard, A. Evans, P. Carry, R. A. Street, C. Petit, G. L. Whiting. Intrinsic Thermal Desorption in a 3D Printed Multifunctional Composite CO2听Sorbent with Embedded Heating Capability. ACS Applied Materials and Interfaces, 听2019, 11, 43337. ()
  32. M. Li, G. Daniel, B. E. Kahn, L. H. Ohara, B. D. F. Casse, N. Pretorius, B. S. Krusor, P. Mei, G. L. Whiting, C. Tonkin, D. Lupo. All-Printed, Large-Area E-Field Antenna Utilizing Printed Organic Rectifying Diodes for RF Energy Harvesting.听 Proceedings of the听2018 IEEE 18th International Conference on Nanotechnology,听2018, DOI: 10.1109/NANO.2018.8626318. ()
  33. P. Mei, G. Daniel, D. E. Schwartz, T. Ng, B. S. Krusor, G. L. Whiting. 听Digital Fabrication and Integration of a Flexible Wireless Sensing Device. 听IEEE Sensors Journal, 2017, 17, 7114. ()
  34. G. L. Whiting, D. E. Schwartz, T. Ng, B. S. Krusor, R. Krivacic, A. Pierre, A. C. Arias, M. Harting, D. VanBuren, K. Short. 听Digitally Fabricated Multi-Modal Wireless Sensing using a Combination of Printed Sensors and Transistors with Silicon Components. 听Flexible and Printed Electronics, 2017, 2, 034002. ()
  35. D. E. Schwartz, J. Rivnay, G. L. Whiting, P. Mei, Y. Zhang, B. S. Krusor, G. Daniel, S. Ready, J. Veres, R. A. Street. 听Flexible Hybrid Electronic Circuits and Systems. 听IEEE Journal on Emerging and Selected Topics in Circuits and Systems, 2016, 7, 27. ()
  36. R. A. Street, T. Ng, D. E. Schwartz, G. L. Whiting, J. P. Lu, R. Bringans, J. Veres. 听From Printed Transistors to Printed Smart Systems. 听Proceedings of the IEEE, 2015, 103, 607. ()
  37. P. Y. Maeda, J. P. Lu, G. L. Whiting, D. K. Biegelsen, S. Raychaudhuri, R. Lujan, J. Veres, E. M. Chow, V. Gupta, G. N. Nielson, S. Paap.听 Micro Chiplet Printer for Micro-scale Photovoltaic System Assembly.听听IEEE听42nd听Photovoltaic Specialist Conference,听2015, 1. ()
  38. S. Ready, G. L. Whiting, T. Ng. 听Multi-Material 3D Printing. 听Proceedings of the NIP & Digital Fabrication Conference, 2014, 120. ()
  39. T. Ng, P. Mei, G. L. Whiting, D. E. Schwartz, B. Abraham, Y. Wu, J. Veres. 听Comparison of Conductor and Dielectric Inks in Printed Organic Complementary Transistors. 听Proceedings of the SPIE, 2014, 9185, 91850X. ()
  40. J. P. Lu, J. D. Thompson, G. L. Whiting, D. K. Biegelsen, S. Raychaudhuri, R. Lujan, J. Veres, L. L. Lavery, A. R. V枚kel, E. M. Chow. 听Open and Closed Loop Manipulation of Charged Microchiplets in an Electric Field. 听Applied Physics Letters, 2014, 105, 054103. ()
  41. A. M. Gaikwad, D. A. Steingart, T. Ng, D. E. Schwartz, G. L. Whiting. 听A Flexible High Potential Printed Battery for Powering Printed Electronics. 听Applied Physics Letters, 2013, 102, 233302. ()
  42. S. Ready, F. Endicott, G. L. Whiting, T. Ng, E. M. Chow, J. P. Lu.听 3D Printed Electronics.听听Proceedings of the NIP & Digital Fabrication Conference,听2013, 9. ()
  43. N. A. D. Yamamoto, L. L. Lavery, B. F. Nowacki, I. R. Grova, G. L. Whiting, B. Krusor, E. R. de Azevedo, L. Akcelrud, A. C. Arias, L. S. Roman. 听Synthesis and Solar Cell Applicaiton of New Alternating Donor-Acceptor Copolymers Based on Variable Units of Fluorene, Thiophene and Phenylene. 听The Journal of Physical Chemistry C, 2012, 116, 18641. ()
  44. T. Ng, D. E. Schwartz, L. L. Lavery, G. L. Whiting, B. Russo, B. Krusor, J. Veres, P. Br枚ms, L. Herlogsson, N. Alam, O. Hagel, J. Nilsson, C. Karlsson. 听Scaleable Printed Electronics: An Organic Decoder Addressing Ferroelectric Non-Volatile Memory. 听Scientific Reports, 2012, 2, 585. ()
  45. A. C. Arias, T. Ng, G. L. Whiting, J. Daniel. 听Printed Thin Film Transistor: Materials and Applications. 听Proceedings of the SPIE, 2011, 8117, 81170Y-1. ()
  46. A. M. Gaikwad, G. L. Whiting, D. A. Steingart, A. C. Arias. 听Highly Flexible, Printed Alkaline Batteries Based on Mesh-Embedded Electrodes. 听Advanced Materials, 2011, 23, 3251. ()
  47. L. L. Lavery, G. L .Whiting, A. C. Arias. 听All Ink-Jet Printed Polyfluorene Photosensor for High Illuminance Detection. 听Organic Electronics, 2011, 11, 682. ()
  48. S. Sambandan, G. L. Whiting, A. C. Arias, R. A. Street. 听Fast Polymer Semiconductor Transistor by Nanoparticle Self-Assembly. 听Organic Electronics, 2010, 11, 1935. ()
  49. A. C. Arias, J. Daniel, T. Ng, S. Garner, G. L. Whiting, L. L. Lavery, B. Russo, B. Krusor. 听Flexible Printed Sensor Tape Based on Solution Processed Materials. 听IEEE 23rd Meeting of the Photonics Society, 2010, 11, 18. ()
  50. G. L. Whiting, A. C. Arias. 听Chemically Modified Ink-Jet Printed Electrodes for Organic Field-Effect Transistors. 听Applied Physics Letters, 2009, 95, 253302. ()
  51. S. Mijalkovic, D. Green, A. Nejim, G. L. Whiting, A. Rankov, E. Smith, J. J. M. Halls, C. E. Murphy. 听Modelling of Organic Field-Effect Transistors for Technology and Circuit Design. 听IEEE 26th International Conference on Microelectronics, 2008, 469. ()
  52. K-H. Yim, G. L. Whiting, C. E. Murphy, J. J. M. Halls, J. H. Burroughes, R. H. Friend, J-S. Kim. 听Controlling Electrical Properties of Conjugated Polymers via a Solution-Based p-type Doping. 听Advanced Materials, 2008, 20, 3319. ()
  53. C. R. McNeil, J. J. M. Halls, R. Wilson, G. L. Whiting, S. Berkebile, M. G. Ramsey, R. H. Friend, N. C. Greenham. 听Efficient Polythiophene/Polyfluorene co-Polymer Bulk Heterojunction Photovoltaic Devices: Device Physics and Annealing Effects.听 Advanced Functional Materials, 2008, 18, 2309. ()
  54. J. C. Pinto, G. L. Whiting, S. Khodabaksh, L. Torre, A. B. Rodr铆guez, R. M. Dalgliesh, A. M. Higgins, J. W. Andreasen, M. M. Nielsen, M. Geoghegan, W. T. S. Huck, H. Sirringhaus. 听Organic Thin Film Transistors with Polymer Brush Gate Dielectrics Synthesized by Atom Transfer Radical Polymerization. 听Advanced Functional Materials, 2008, 18, 36. ()
  55. G. L. Whiting, H. J. Snaith, S. Khodabakhsh, J. W. Andreasen, D. W. Brieby, M. M. Nielsen, N. C. Greenham, R. H. Friend, W. T. S. Huck. 听Enhancement of Charge Transport Characteristics in Polymeric Films using Polymer Brushes. 听Nano Letters, 2006, 6, 573. ()
  56. H. J. Snaith, G. L. Whiting, B. Sun, N. C. Greenham, W. T. S. Huck, R. H. Friend.听 Self-Organization of Nanocrystals in Polymer Brushes. 听Application in Heterojunction Photovoltaic Devices. 听Nano Letters, 2005, 5, 1653. ()
  57. W. U. Huynh, J. J. Dittmer, W. C. Libby, G. L. Whiting, A. P. Alivisatos. 听Controlling the Morphology of Nanocrystal-Polymer Composites for Solar Cells. 听Advanced Functional Materials, 2003, 13, 73. ()

Book Chapters

  1. R. A. Street, T. Ng, S. E. Ready, G. L. Whiting. 听Printing Techniques for Display Fabrication. 听In Handbook of Visual Display Technology. 听C. Janglin, W. Cranton, M. Fihn, Eds., Springer, 2015, pp 1289-1303. ()
  2. G. L. Whiting, T. Farhan, W. T. S. Huck. 听Polymer Brushes: 听Towards Applications. 听In Polymer Brushes: Synthesis, Characterization, Applications. 听R. C. Advincula, W. J. Brittain, K. C. Caster, J. R眉he, Eds., Wiley-VCH, 2004, pp 371-380. ()

US Patents

  1. 11,479,850 (2022) -听Systems and Methods for Implementing Digital Vapor Phase Patterning using Variable Data Digital Lithographic Printing Techniques ()
  2. 11,417,849 (2022) - Fabrication of Corrugated Gate Dielectric Structures using Atomic Layer Etching ()
  3. 10,903,176 (2021) - Method of Forming a Photodiode ()
  4. 10,903,173 (2021) - Pre-Conditioned Self-Destructing Substrate ()
  5. 10,818,842 (2020) - Selective Surface Modification of OTFT Source/Drain Electrodes by Ink-Jetting F4TCNQ ()听
  6. 10,740,577 (2020) - Passive Sensor Tag System ()
  7. 10,490,746 (2019) - Selective Surface Modification of OTFT Source/Drain Electrodes by Ink-Jetting F4TCNQ ()听
  8. 10,466,193 (2019) - Printed Gas Sensor ()
  9. 10,332,717 (2019) - Self-Limiting Electrical Triggering for Initiating Fracture of Frangible Glass ()
  10. 10,283,725 (2019) - Organic Schottky Diodes ()
  11. 10,262,954 (2019) - Transient Electronic Device with Ion-Exchanged Glass Treated Interposer ()
  12. 10,224,297 (2019) - Sensor and Heater for Stimulus-Initated Fracture of a Substrate ()
  13. 10,206,288 (2019) - Bare Die Intergation with Printed Components on Flexible Substrate ()
  14. 10,202,990 (2019) - Complex Stress-Engineered Frangible Structures ()
  15. 10,199,586 (2019) - Device Comprising Dielectric Interlayer ()
  16. 10,178,447 (2019) - Sensor Network System ()
  17. 10,165,677听(2018) - Bare Die Integration with Printed Components on a Flexible Substrate without Laser Cut ()
  18. 10,014,261 (2018) - Microchip Charge Patterning ()
  19. 10,012,250 (2018) - Stress-Engineered Frangible Structures ()
  20. 9,952,082 (2018) - Printed Level Sensor ()
  21. 9,886,862 (2018) - Automated Air Traffic Communications ()
  22. 9,780,044 (2017) - Transient Electronic Device with with Ion-Exchanged Glass Treated Interposer ()
  23. 9,629,252 (2017) - Printed Electronic Components on Universally Patterned Substrate for Integrated Printed Electronics ()
  24. 9,594,039 (2017) - Photometric Enthalpy Change Detection System and Method ()
  25. 9,579,904 (2017) - System and Method for Thermal Transfer of Thick Metal Lines ()
  26. 9,473,047 (2016) - Method for Reduction of Stiction while Manipulating Micro-Objects on a Surface ()
  27. 9,431,283 (2016) - Direct Electrostatic Assembly with Capacitively Coupled Electrodes ()
  28. 9,396,972 (2016) - Micro-assembly with Planarized Embedded Microelectronic Dies ()
  29. 9,356,603 (2016) - Thermally Tempered Glass Substrate using CTE Mismatched Layers and Paste Mixtures for Transient Electronic Systems ()
  30. 9,356,248 (2016) - n-Type Organic Thin-Film Transistor using Semiconductor Blend ()
  31. 9,305,807 (2016) - Fabrication Method for Microelectronic Components and Microchip Inks used in Electrostatic Assembly ()
  32. 9,219,126 (2015) - High-k Dielectrics with a Low-k Interface for Solution Processed Devices ()
  33. 9,154,138 (2015) - Stressed Substrates for Transient Electronic Systems ()
  34. 8,884,156 (2014) - Solar Energy Harvesting Device using Stimuli-Responsive Material ()
  35. 8,872,224 (2014) - Solution Processed Neutron Detector ()
  36. 8,735,871 (2014) - Cross-Linked Fluorinated Dielectrics for Organic Thin Film Transistors ()
  37. 8,685,769 (2014) - Microchip Charge Patterning ()
  38. 8,642,379 (2014) - Oxidized Contacts for Thin Film Transistors ()
  39. 8,502,356 (2013) - Controlled Semiconductor Crystallization in Organic Thin Film Transistors ()
  40. 8,481,994 (2013) - Contact Doping for Organic Thin Film Transistors ()
  41. 8,481,360 (2013) - Vertical Channel Organic Thin Film Transistor ()
  42. 8,450,142 (2013) - Containment of Organic Semiconductor in Thin Film Transistors ()
  43. 8,430,705 (2013) - Self Assembly of Field Emission Tips by Capillary Bridge Formations ()
  44. 8,394,665 (2013) - Contact Treatments for Organic Thin Film Transistors ()
  45. 8,089,065 (2012) - Self Aligned Process for Organic Thin Film Transistors ()
  46. 8,053,818 (2011) - Thin Film Field Effect Transistor with Dual Semiconductor Layers ()
  47. 8,040,609 (2011) - Self-Adjusting Solar Light Transmission Apparatus ()

Selected Media Coverage

  1. CU Boulder Innovators Awarded $1.25M in Collercialization Funding (2022): CU Boulder
  2. In the Air, on the Ground, and Everywhere in Between听(2022): CU Engineering Magazine
  3. The Internet of Living Things (2021):听CU Engineering Magazine
  4. Cheap Sensors for Smarter Farmers (2021):
  5. Seed grant could lead to materials needed for unconventional computing revolution (2021): CU Boulder
  6. Biodegradable sensors aim to make farming more effecient (2020): June/July 2020 issue of听
  7. CU researchers to explore 3D printing in reduced gravity with NASA grant (2020): CU Boulder
  8. Creating the Internet of Living Things (2019): CU Boulder
  9. ARPA-E Award for Agricultural Sensors (2019): , CU Boulder, Press release from US Senators and .听
  10. Transient electronic systems based on stress engineered glass (2015): , , , , , , and others.
  11. Printed hybrid electronic systems for space applications (2013):听
  12. Electrostatic microassembly for micro manufacturing (2013):