Representative Committee Services for Professional Conferences

  1. Editor, ASME Journal of Electronic Packaging, 2014-present.
  2. Associate Technical Editor, ASME Journal of Electronic Packaging听(2001-2004)
  3. Guest Technical Editor, IEEE Transaction on Advanced Packaging (2003-2005)
  4. NSF Workshop on Optoelectronic Packaging, 1991, workshop organizer.
  5. NSF Symposium on Optoelectronic Packaging Science, 1992, steering committee.
  6. ASME听Symp. on the Manufacturing Aspects in Elec. Packaging, 1992, symposium organizer.
  7. NSF Workshop on Optoelectronic Packaging, 1993, Program Chairman.
  8. ASME听Symp. on the Manufacturing Aspects in Elec. Packaging, 1993, symposium organizer.
  9. NSF International Workshop on Optoelectronic Packaging, 1994, program chair.
  10. SPIE Symposium on Optoelectronic Packaging, 1996,听symposium听听co-organizer.
  11. SPIE听Symp. on Micro-Optics Integration and Assemblies, 1998, symposium co-organizer.
  12. IMAPS Adv. Tech. Workshop on MEMS Packaging, 1999, Technical Program Co-chair.
  13. ASME IMECE, Orlando, November 5-11, 2005, Session Chair.
  14. ASME IMECE, Chicago, November 6-10, 2006, Session Chair.
  15. Track Chair of Panel Sessions, IEEE听ITherm听2012, 2014 and 2016.
  16. Advisory Board, Int隆娄l听Symp. on Materials S. for Sustainable Society, Japan, 2011 and 2013.
  17. ASME International Intersociety Electronic Packaging Conference, Advisory Committee (2017, 2015, 2013, 2011, 09, 07, 05, & 03), General Chair (2001), Technical Chair (1999), Track Chairs (2011, 2013 and 2015)