Team 4 Cover Image

Above: The final physical assembly of Project Wasp (Wafer Automated Surface Profiler). Project WASP explores non-contact silicon wafer measurement methods for the semiconductor industry for quality control.

Project WASP explores non-contact methods of measuring silicon wafers for the semiconductor industry. The team developed an automated wafer transfer system enclosed in a test bench and a measurement system to determine surface profiles while the wafer is moving. This measurement must be taken in parallel with existing operations in order to minimize any effects of throughput to the system.

Sponsorship

Sponsored by KLA Corporation

Director

Paul Brayford

Team Members

  • Ìý- Systems/Test Engineer
  • Sean ConnellyÌý- CAD/Software Engineer
  • Ìý- Logistics Manager
  • Ìý- Financial Manager
  • Ìý- Project Manager
  • Ìý- Manufacturing Engineer

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